Manufacturing Capacity
24-hour turn around for 2-layer PCBs, 2-7 working days for multilayer PCBs;
Over 3000 different models supplied every month.
Production Capabilities (Rigid PCB):
1. Material: FR4,High TG FR4,FR4 Halogen free, Aluminum based FR4, Rogers material etc. 2. Layer counts: 2-28L 3.Finished Copper:0.5-5OZ 4.Finished Board thickness: 0.2-6.0mm 5.Max finished board size: 24x35 inch 6.Mini line width: 4mil 7.Mini line space: 4mil 8.Mini overall board outline tolerance: +/-0.1mm 9.Mini drilling hole size:0.2mm 10.Mini drilling slot size: 0.6mm 11.Mini via pad diameter: 18mil 12.Max Aspect Ratio: 12:1 13.Mini solder mask bridge: 4mil (SMT pads space can be 8mil) 14.Mini solder mask thickness: 10um 15.Solder mask hardness: 6H 16.Mini silkscreen tracks: 5mil 17.Mini silkscreen tracks height: 30mil 18.Mini space between holes to tracks: 8mil(2-6L), 10mil(>=8L) 19.Solder mask color(LPI): Green, Red, White, Blue, Black, Yellow, Matt etc. 20.Silkscreen(Legend) color: White, Black, Yellow etc. 21.Surface finish: HAL, Lead Free HAL, Immersion Gold(ENIG), Immersion Tin/Silver, OSP etc. 22.Special technology: Gold finger, Peelable mask, Blinded or Buried vias, Impedance control etc. 23.Reliable test: Flying Probe Test, Fixture Test, Impedance Test, Solderbility Test, Micro-section Analysis, Thermal Shock Test, Hi-Pot Test etc. 24.Wrap and twist: <0.7% 25.Flammability: 94V-0 26.Inspection standard: IPC-A-600F
Production Capabilities (FPC):
1.Material: Polyimide,Polyester 2.Layer Counts: 1-6L 3.Min Line Width/Space: 3/3mil 4.Max Board size: 500*500mm 5.Drilling diameter:0.25mm-6.5mm 6.Base material copper thickness: 12um-70um 7.Insulate layer thickness: 0.0125-0.05mm (PI thickness) 8.Electronic plating Sn/Pb thickness: 3µm --- 20µm 9.Electronic plating Au thickness: =0.05µm 10.Chemical immersion Ni/Au thickness: 0.05µm --- 0.1µm 11.Electronic plating Sn thickness: 3µm --- 20µm 12.Etching width/space: S: 3.5mil (0.076mm),D?F?M: 4.5mil (0.100mm) 13.Etching tolerance: width ±20? (special ±10?) 14.Board Outline tolerance: ±0.1mm, ±0.05mm(the same mould) 15.Parts fixed position tolerance: ±0.2mm 16.Insulation Resistance: 1011O(Normal) 17.Thermal Shock Resistance: 260? 10 seconds 18.Peel Off Strength: >1.0N/mm 19.Inspection Standard: IPC-A-600F |